300576
PCB INK | Positive photoresist | Special Inks |
1.特别说明:
具体型号说明书及相关检测报告请前往下载中心下载。
2.使用客户:
A、深圳崇达多层线路板有限公司 B、深圳市景旺电子股份有限公司 C、金像电子股份有限公司 D、川亿电脑(重庆)有限公司 E、天津普林电路股份有限公司
3.应用领域:
我公司液态感光阻焊油墨是印制电路板制造过程中不可缺少的基础材料,其作用是在电路板焊锡或部件组装时,防止电路板表面附着不必要的焊料。
液态感光阻焊油墨形成的是永久性保护膜,该保护膜能防止PCB铜面氧化,防止水汽侵蚀,防止溶剂腐蚀和外物擦伤,更能提高线路间及整个板面的电气绝缘性能,从而延长印制线路板的使用寿命。
丝网印刷是液态感光阻焊油墨的主要成膜方式。当阻焊油墨涂覆到蚀刻后的基板上,经过预烤、曝光、显影、后固化等一系列工艺过程最后在印制板表面形成一种交联固化的聚合物涂层。阻焊膜具有很高的光亮度、硬度和附着力,优异的耐热冲击性、耐酸碱、耐溶剂。
4. 技术参数:
颜色 |
蓝色或乳白色 |
主剂 |
THW-5J060 |
固含 |
≥ 95% |
粘度 |
300~800dPa?s |
烘烤 |
130℃~160℃30min |
保存期限 |
生产后3个月(保存在25℃以下阴暗环境) |
1.special note:
You will found the specifications of specific model and related test reports in download center.
2.Our clients:
1、Shenzhen Chongda multilayer circuit board Co., Ltd. 2、Shenzhen Jing Wang Electronic Co., Ltd. 3、Jinxiang Electronics Co., Ltd. 4、Chuanyi computer (Chongqing) Co., Ltd. 5、Tianjin PRINTRONICS circuit Co., Ltd.
3.Application areas:
Liquid Photoimageable Solder Resist Ink will form a permanent protection film, not onlythis film can prevent the copper PCB surface fromoxidating, water corroding, solvent corroding and external abrading.But also it can improve electrical insulating properties between lines, even forfull plate surface, so as to prolong the service lifeof the printed circuit board.
Screen printing is the main film-forming way of liquid photoimageable solder resist ink.When the ink is covered to the etching substrate. There will be created a new coating ofcrosslinking curing polymer on the surface of the printing plate after a series of technological process, such as pre cure, exposure, development and post curingetc.Solder resist film has a high light brightness, hardness and adhesion, excellent heat shock resistance, acid and alkali resistance, and solvent resistance properties.
4.Parameters:
Items |
Test conditions |
Test results |
Fineness |
Flight fineness method; < 5 mu m |
PASS |
viscosity |
Viscosity VT-04F (25℃); 160 +/-20 dPa.s
|
160dPa.s |
Screen printing reslt
|
Screen printing; uniform color, no shrinkage&no bubble, no white spots
|
PASS |
Pre Cure |
75℃+- 5℃; non stick film
|
PASS |
Photosensitive |
7K, 8K exposure machine energy 9-12 level
|
PASS |
Development |
1%Na2CO3 aqueous solution 30℃; surface and pore clean, not excessive.
|
PASS |
Curing |
150 +/- 5℃, 60 minutes, ink cured completely
|
PASS |
Adhesion |
IPC-SM-840 3.5.2.1/IPC-TM-650 2.4.28.1 after cross cutting by Crossing-Cut Tester, do peel test by using tape
|
100/100 |
Pencil hardness
|
IPC-SM-840C 3.5.1/IPC-TM-650 2.4.27.2; Qualified as no destroy on film by scratch, no visualizing of the copper foil
|
≥6H |
Soldering Resistance |
Flux of rosin flux; floating tin: 288℃ /10 seconds x 3 times
|
PASS |
Solvent resistance |
Propylene glycol ether acetate; 30 minutes after soaking at room temperature, do peel test tape |
PASS |
acid resistance
|
10vol% H2SO4; 30 minutes after soaking at room temperature, do peel test tape
|
PASS |
alkali resistance
|
10wt% NaOH; 30 minutes after soaking at room temperature, do peel test tape
|
PASS |
The technical parametersarefrom our internal test results. Only for your reference. We suggest you applying by setting appropriate using conditions after confirming experiment.
1.special note:
You will found the specifications of specific model and related test reports in download center.
2. Our clients:
1、Jianding(Wuxi) Electronic Co.,LTD. 2、Shanghai Meiwei Electronic Co.LTD. 3、Yilianda Electronic Co.,Ltd. 4、Hongban(Jiangxi) Co..Ltd. 5、Yuehu circuit(Suzhou) Co.LTD
3.Application:
The liquidphotoimageable solder resist ink is the most important basic material in process of printing PCB production. It can protect the surface of circuit board from adheringwelding flux while solering tin for the circuit board or assembling the parts.
4. Parameters:
Color |
Blue or purple viscosity liquid |
|
viscosity |
45~55 dPa?s (VT-04F、can be adjusted) |
|
Content |
45%~55% |
|
Adhesion |
100/100(3M tape way) |
|
resolution |
50μm |
|
Pre-cure |
Hot air convection oven |
75±5℃ 1st side, 5min;2nd side, simultaneous bake of both sides:;simultaneous bake of both sides: 15min;
|
Infrared channel oven |
Vertical type: 85~95℃ 7~8mim; Horizontal type: 130~160℃ 1~2 min |
|
Stand exposure energy |
60 ~120 mJ/cm2 5~8 level(achived) |
|
Shelf life |
6 months(stored in the dark place at less than 25℃ |
|
Shelf life after open |
24 hours (stored in the dark place at less than 25℃, relative humidity 50-75%RH)
|
Product Specification of UVS-1000 UV Curable Solder Resist Ink
I. Introduction
UVS-1000 type solder resist ink is UV curing solder mask developed for printing circuit board. It does not contain solvent without pollution. It is characterized by fast curing, excellent adhesion after curing and excellent heat resistance and insulation. Technical parameters are showed in the following table (at room temperature condition unless otherwise noted):
Model
Properities |
UVS-1000 |
|
Color |
G (green), BL (blue) |
|
Viscosity (VT-04E/F) |
130±30 dPa.s |
|
Cure condition |
Number and variety of lamps |
High pressure mercury lamp or halogen lamp 80W/cm |
Irradiation distance |
10 cm |
|
Transmitter speed |
3~7m/min |
|
Film hardness |
4H |
|
Adhesion |
100/100 |
|
Chemical resistance |
10%H2SO4 5%NaOH, C2H3CL3, 60 min No discoloration or falling out |
|
Insulation resistance |
Above 1×1011 |
|
Package |
5 kg/barrel |
|
Shelf life |
6 months |
II. Process conditions
1. Oiling
Use it after mixing for 15 min thoroughly and leaving it alone for 15 min.
2. Pre-treat the substrate
3~5% sulfuric acid or hydrochloric acid for water cleaning, grinding defect for 15~20 mm, water film cracking for more than 10 sec, meshes of brushing roller 300 and 500, polish brushing current 2.5~3.0 A and drying temperature 80~120 ℃.
3. Printing
Screen 90~100T silk screen, scraping hardness 65~75, scraper angle 70~80°, inclination 20~35°, screen distance 4~6 mm, rest scraping rubber ≥15 mm, the length of scraper in one side is 10~20 mm longer than the printing graph, machine printing pressure 1.0~2.0 kgf/cm2, screen speed 50~70 HZ, printing film thickness 10~15 μm.
4. Curing
The energy of 5~8 kw mercury lamp or halogen lamp (mercury lamp) is above 1000mj/cm2, the distance to irradiate plate surface is 8~10cm and the usage time of lamp tube is controlled within 1,000 hours.
1. FEATURES:
H-8100 8WL501 is a type of bi-component dilute aqueous alkali developing liquid phptosensitive solder resist ink. it mainly has the following features:
1) Provided with fairly perfect printing behavior; capable of compactly covering the surface of the printed object;
2) Provided with excellent hardness, wear resistance, compactness cutability, chemical resistance, and heat resistance etc.;
3) Provided with excellent electrical performance;
4) It had passed the SGS Test, known as a type of environmental-friendly product.
2. Specification
Color* |
White |
Mixing Ratio |
Main agent : Hardener = 750: 250 (by weight) |
Viscosity* |
160 ±20 dpa?s (Mode Viscometer, 5min-1 / 25℃) |
Pre-cure* |
75±2℃ 60 min (Max) |
Standard exposure energy* |
500 ~ 800 mJ/cm2 ( ( on the solder mask ) |
Storage life after mixture* |
24 hours ( stored in dark place at less than 25℃) |
Storage life |
6 month (keep it in dark place under 25℃) |
“* ”Means the situation after main agent mix up with hardener.