Stock code
300576
300576
| PCB INK | Positive photoresist | Special Inks |
Positive photoresist for display
Introduction
1. special note:
You will found the specifications of specific model and related test reports in download center.
2．Application:
For display area: ITO electrode fabricating of TN/STN-LCD；ITO electrode of TP、Mo/Al/Mo Sensor fabricating；TFT backboard of TFT-LCD/OLED etc..
3. Technical parameters: (Positive photoresist for display)
Include of RD-PFR/PFS、RD-PTL500、RD-PTH800 series，The main technical parameters from different series are as below
|
Items |
Series products |
Main parameters |
|
1 |
RD-PFR/PFS series |
Moisture: <0.5%; particles (0.5um particles, /ml):<100; trace metals (K, Na, Fe, ppb): <500; film thickness: 1.2~2.2um; resolution: 2um (g+h+i exposure) |
|
2 |
RD-PTL500 series |
Moisture: <0.5%; particles (0.5um particles, /ml):<100; trace metals (K, Na, Fe, ppb): <300; film thickness: 1.4~2.2um; resolution: 1.5um (g+h+i exposure) |
|
3 |
RD-PTH800 series |
Moisture: <0.5%; particles (0.5um particles, /ml):<100; trace metals (K, Na, Fe, ppb): <500; film thickness: 1.4~2.2um; resolution: 1.5um (g+h+i exposure) |
Introduction
1. special note:
You will found the specifications of specific model and related test reports in download center.
2．Application:
Specific applications in the field of integrated circuits : the production of integrated circuits (involving metal layer, passivation layer, ion implantation layer lithography); advanced packaging of integrated circuit etc..
3 Technical parameters:
Main technical parameters of photoresist for integrated circuits:
Mainly include: RD-4000, RD-6000 and other series, the main technical parameters of different series photoresist are as follows:
|
Items |
Series products |
Main parameters |
|
1 |
RD-4000 series |
Moisture: <0.5% Particles (0.5um particles, /ml):<100 Trace metals (K, Na, Fe, ppb): <50 Film thickness: 1.0~4.5um Resolution: 0.4um (i-line exposure) |
|
2 |
RD-6000 series |
Moisture: <0.5% Particles (0.5um particles, /ml):<100 Trace metals (K, Na, Fe, ppb): <100 Film thickness: 3.0~15um Resolution: 0.65um (i-line exposure) |
1 Special note:
You will found the specifications of specific model and related test reports in download center.
2 Application:
Specific applications in the field of semiconductor lighting: patterned sapphire substrate (PSS) production; LED chip production etc..
3 Technical parameters:
Main technical parameters of photoresist for semiconductor lighting:
The series of semiconductor lighting mainly include: RD-2000, RD-4000, RD-6000, RD-NL700 series, the main technical parameters of different series of photoresist are as follows:
|
Items |
Series products |
Main parameters |
|
1 |
RD-2000 series |
Moisture: <0.5%; particles (0.5um particles, /ml):<100; trace metals (K, Na, Fe, ppb): <300; film thickness: 1.0~3.5um; resolution: 0.8um (g-line) |
|
2 |
RD-4000 series |
Moisture: <0.5%; particles (0.5um particles, /ml):<100; trace metals (K, Na, Fe, ppb): <50; film thickness: 1.0~4.5um; resolution: 0.4um (g-line) |
|
3 |
RD-6000 series |
Moisture: <0.5%; particles (0.5um particles, /ml):<100; trace metals (K, Na, Fe, ppb): <100; film thickness: 3.0~15um; resolution: 0.65um (g-line) |
|
4 |
RD-NL700 series |
Moisture: <0.5%; particles (0.5um particles, /ml):<100; trace metals (K, Na, Fe, ppb): <500; film thickness: 1.8~4.5um; Trapezoidal angle: 45~80 degrees resolution: 1um (g-line) |