Stock code
300576
300576
| PCB INK | Positive photoresist | Special Inks |
Introduction
1. special note:
You will found the specifications of specific model and related test reports in download center.
2．Application:
Specific applications in the field of integrated circuits : the production of integrated circuits (involving metal layer, passivation layer, ion implantation layer lithography); advanced packaging of integrated circuit etc..
3 Technical parameters:
Main technical parameters of photoresist for integrated circuits:
Mainly include: RD-4000, RD-6000 and other series, the main technical parameters of different series photoresist are as follows:
|
Items |
Series products |
Main parameters |
|
1 |
RD-4000 series |
Moisture: <0.5% Particles (0.5um particles, /ml):<100 Trace metals (K, Na, Fe, ppb): <50 Film thickness: 1.0~4.5um Resolution: 0.4um (i-line exposure) |
|
2 |
RD-6000 series |
Moisture: <0.5% Particles (0.5um particles, /ml):<100 Trace metals (K, Na, Fe, ppb): <100 Film thickness: 3.0~15um Resolution: 0.65um (i-line exposure) |
Main technical parameters of photoresist for integrated circuits:
Mainly include: RD-4000, RD-6000 and other series, the main technical parameters of different series photoresist are as follows:
|
Items |
Series products |
Main parameters |
|
1 |
RD-4000 series |
Moisture: <0.5% Particles (0.5um particles, /ml):<100 Trace metals (K, Na, Fe, ppb): <50 Film thickness: 1.0~4.5um Resolution: 0.4um (i-line exposure) |
|
2 |
RD-6000 series |
Moisture: <0.5% Particles (0.5um particles, /ml):<100 Trace metals (K, Na, Fe, ppb): <100 Film thickness: 3.0~15um Resolution: 0.65um (i-line exposure) |
