Stock code
300576
300576
| PCB INK | Positive photoresist | Special Inks |
H-8100 WB series is a type of bi-component dilute aqueous alkali developing liquid phptosensitive solder resist ink. it mainly has the following features
1. FEATURES:
H-8100 8WL501 is a type of bi-component dilute aqueous alkali developing liquid phptosensitive solder resist ink. it mainly has the following features:
1） Provided with fairly perfect printing behavior; capable of compactly covering the surface of the printed object;
2） Provided with excellent hardness, wear resistance, compactness cutability, chemical resistance, and heat resistance etc.;
3） Provided with excellent electrical performance;
4） It had passed the SGS Test, known as a type of environmental-friendly product.
2. Specification
|
Color* |
White |
|
Mixing Ratio |
Main agent : Hardener = 750: 250 (by weight) |
|
Viscosity* |
160 ±20 dpa?s (Mode Viscometer, 5min-1 / 25℃) |
|
Pre-cure* |
75±2℃ 60 min (Max) |
|
Standard exposure energy* |
500 ~ 800 mJ/cm2 ( ( on the solder mask ) |
|
Storage life after mixture* |
24 hours ( stored in dark place at less than 25℃) |
|
Storage life |
6 month (keep it in dark place under 25℃) |
“* ”Means the situation after main agent mix up with hardener.
1、Process:
|
Process |
Range |
|
|
PWB |
FR–4 1.6 mmt |
— |
|
Pre-treatment |
Acid treatment → brushing |
— |
|
Printing |
43T mesh-count |
— |
|
Hold time |
10 min |
10～20 min |
|
Tack free |
?One side each exposure
1 st printing : 75℃ / 20 min
2nd printing : 75℃ / 30 min
Both sides simultaneous exposure 75℃ / 40 min
|
75℃/15～25min 75℃/25～35min 75℃/35～45min |
|
Exposure |
600mJ/cm2 (on the solder mask) |
300～500mJ/cm2 |
|
Hold time |
10min |
10～20min |
|
Development |
Aqueous alkaline solution : 1 wt% Na2CO3
Temperature of developer : 30℃
Spray pressure : 0.196 MPa
Developing time : 60 sec
|
0.2～0.25MPa 50～70 sec |
|
Post cure |
150℃ / 60 min ( Hot air convection oven )
|
— |
|
Item |
Test method |
Test result |
|
Adhesion |
IPC-SM-840C 3.5.2.1/ IPC-TM-650 2.4.28.1 Cross-cut tape stripping test |
100/100 |
|
Pencil hardness |
IPC-SM-840C 3.5.1 / IPC-TM-650 2.4.27.2 On copper foil, no Cu exposure |
6H |
|
Solder heat resistance |
Solder float test : Rosin flux, 280℃/10 sec×3 cycle
|
Pass |
|
Solvent resistance |
PMA dipping, room temp./ 30 min Scotch tape stripping
|
Pass |
|
Acid resistance |
10 vol % H2SO4, room temp./ 30 min Scotch tape stripping
|
Pass |
|
Alkaline resistance |
10 wt% NaOH, room temp./ 30 min Scotch tape stripping
|
Pass |
Note : The above-mentioned test data is just for reference, not to guarantee the result.
5. PRECAUTIONS
1) The product should be stored or handled at a place with temperature of 10-25℃ and relative humidity of 50-75%RH; in addition, only yellow light is allowed; do not handle the product in White electric light or sunlight (whether directly or indirectly).
2) The product should be applied in its original state; when it is necessary to adjust the viscosity, it is required to adopt diluent, and the proportion must be controlled within 3%. Please do the experiment of matching first while adopting other diluent.
3) Once the product is mixed, it should be used up within 24 hours. When opening the can, hand mix it for 1-2 min at first before machine stirring.
4) Surface treatment of bared board has a critical impact on full play of solder resist behaviors.
Before printing operation, in order to ensure that the PCB surfaces are thoroughly cleaned, dried, and the oxide layer is removed, it is advisable to treat the PCB with chemical microetch and mechanical polish-brush separately or simultaneously so as to absolutely remove the oxide, oil, fat or other pollutant on surfaces of bared boards; wash the boards with water and the
dry them adequately; avoid finger touch and carry out solder-resist printing operation as soon as possible for fear of poor adhesive power of printing ink, or degradation of solder-resist performance. Pretreatment for golden board may be soft polish-brush (polish-brush #1000 at least), citric-acid immersion or spraying. Pay special attention to the attendance of pretreatment equipment after water washing phase so that the secondary pollution of board surface can be avoided.
5) Exposure energy may vary as per different bared boards and thickness of printing ink. Please carry out test to determine the lateral
erosion grade, surface gloss and reverse-side light-sensation grade. Photometer should be set to level 9-12.
6) Adequately manage the developing solution concentration, temperature, nozzle pressure and time etc. Inadequate management may lead to poor developing performance of printing ink, lateral erosion or blister. In addition, Spray nozzle of developing machine should be regularly smoothed so as to ensure proper developing /rinsing effect in operation.
7) Developing should be within 48 hours after coating. If workshop to be warm and humid and relatively heavy, take to finish the operation within 12hours.
8) In case skin or eyes are exposed to the product, it is required to clean with soap and rinse with plenty of fresh water; do not clean with any solvent.
9) The product is inflammable, and it must not be placed or applied in a site with smoke and fire.