Product Specification of UVS-1000 UV Curable Solder Resist Ink

I. Introduction

UVS-1000 type solder resist ink is UV curing solder mask developed for printing circuit board. It does not contain solvent without pollution. It is characterized by fast curing, excellent adhesion after curing and excellent heat resistance and insulation. Technical parameters are showed in the following table (at room temperature condition unless otherwise noted):

II. Process conditions

1. Oiling

Use it after mixing for 15 min thoroughly and leaving it alone for 15 min.

2. Pre-treat the substrate

3~5% sulfuric acid or hydrochloric acid for water cleaning, grinding defect for 15~20 mm, water film cracking for more than 10 sec, meshes of brushing roller 300 and 500, polish brushing current 2.5~3.0 A and drying temperature 80~120 ℃.

3. Printing

Screen 90~100T silk screen, scraping hardness 65~75, scraper angle 70~80°, inclination 20~35°, screen distance 4~6 mm, rest scraping rubber ≥15 mm, the length of scraper in one side is 10~20 mm longer than the printing graph, machine printing pressure 1.0~2.0 kgf/cm2, screen speed 50~70 HZ, printing film thickness 10~15 μm.

4. Curing

The energy of 5~8 kw mercury lamp or halogen lamp (mercury lamp) is above 1000mj/cm2, the distance to irradiate plate surface is 8~10cm and the usage time of lamp tube is controlled within 1,000 hours.