Stock code
300576
300576
| PCB INK | Positive photoresist | Special Inks |
1.special note:
You will found the specifications of specific model and related test reports in download center.
2.Our clients:
1、Shenzhen Chongda multilayer circuit board Co., Ltd. 2、Shenzhen Jing Wang Electronic Co., Ltd. 3、Jinxiang Electronics Co., Ltd. 4、Chuanyi computer (Chongqing) Co., Ltd. 5、Tianjin PRINTRONICS circuit Co., Ltd.
3.Application areas:
Liquid Photoimageable Solder Resist Ink will form a permanent protection film, not onlythis film can prevent the copper PCB surface fromoxidating, water corroding, solvent corroding and external abrading.But also it can improve electrical insulating properties between lines, even forfull plate surface, so as to prolong the service lifeof the printed circuit board.
Screen printing is the main film-forming way of liquid photoimageable solder resist ink.When the ink is covered to the etching substrate. There will be created a new coating ofcrosslinking curing polymer on the surface of the printing plate after a series of technological process, such as pre cure, exposure, development and post curingetc.Solder resist film has a high light brightness, hardness and adhesion, excellent heat shock resistance, acid and alkali resistance, and solvent resistance properties.
4.Parameters:
|
Items |
Test conditions |
Test results |
|
Fineness |
Flight fineness method; < 5 mu m |
PASS |
|
viscosity |
Viscosity VT-04F (25℃); 160 +/-20 dPa.s
|
160dPa.s |
|
Screen printing reslt
|
Screen printing; uniform color, no shrinkage&no bubble, no white spots
|
PASS |
|
Pre Cure |
75℃+- 5℃; non stick film
|
PASS |
|
Photosensitive |
7K, 8K exposure machine energy 9-12 level
|
PASS |
|
Development |
1%Na2CO3 aqueous solution 30℃; surface and pore clean, not excessive.
|
PASS |
|
Curing |
150 +/- 5℃, 60 minutes, ink cured completely
|
PASS |
|
Adhesion |
IPC-SM-840 3.5.2.1/IPC-TM-650 2.4.28.1 after cross cutting by Crossing-Cut Tester, do peel test by using tape
|
100/100 |
|
Pencil hardness
|
IPC-SM-840C 3.5.1/IPC-TM-650 2.4.27.2; Qualified as no destroy on film by scratch, no visualizing of the copper foil
|
≥6H |
|
Soldering Resistance |
Flux of rosin flux; floating tin: 288℃ /10 seconds x 3 times
|
PASS |
|
Solvent resistance |
Propylene glycol ether acetate; 30 minutes after soaking at room temperature, do peel test tape |
PASS |
|
acid resistance
|
10vol% H2SO4; 30 minutes after soaking at room temperature, do peel test tape
|
PASS |
|
alkali resistance
|
10wt% NaOH; 30 minutes after soaking at room temperature, do peel test tape
|
PASS |
The technical parametersarefrom our internal test results. Only for your reference. We suggest you applying by setting appropriate using conditions after confirming experiment.
|
Items |
Test conditions |
Test results |
|
Fineness |
Flight fineness method; < 5 mu m |
PASS
|
|
viscosity |
Viscosity VT-04F (25℃); 160 +/- 20 dPa.s
|
160dPa.s
|
|
Screen printing reslt
|
Screen printing; uniform color, no shrinkage&no bubble, no white spots |
PASS
|
|
Pre Cure |
75℃ +- 5℃; non stick film |
PASS
|
|
Photosensitive |
7K, 8K exposure machine energy 9-12 level
|
PASS
|
|
Development
|
1%Na2CO3 aqueous solution 30℃; surface and pore clean, not excessive.
|
PASS
|
|
Curing
|
150 +/- 5℃, 60 minutes, ink cured completely |
PASS
|
|
Adhesion
|
IPC-SM-840 3.5.2.1/IPC-TM-650 2.4.28.1 after cross cutting by Crossing-Cut Tester, do peel test by using tape |
100/100
|
|
Pencil hardness
|
IPC-SM-840C 3.5.1/IPC-TM-650 2.4.27.2; Qualified as no destroy on film by scratch, no visualizing of the copper foil |
More than 6H |
|
Soldering Resistance |
Flux of rosin flux; floating tin: 288℃ /10 seconds x 3 times
|
PASS
|
|
|
Propylene glycol ether acetate; 30 minutes after soaking at room temperature, do peel test tape |
PASS
|
|
acid resistance
|
10vol% H2SO4; 30 minutes after soaking at room temperature, do peel test tape |
PASS
|
|
alkali resistance
|
10wt% NaOH; 30 minutes after soaking at room temperature, do peel test tape |
PASS
|
The technical parameters are from our internal test results. Only for your reference. We suggest you applying by setting
appropriate using conditions after confirming experiment.
